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CINDAS

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The CINDAS database provides two applications:

  • Microelectronics Packaging Materials Database (MPMD) (Access)
  • Thermophysical Properties of Matter Database (TPMD) (Access)

Useful for finding and graphing chemical and physical properties of materials.

MPMD

Using MPMD, you can browse by material group, search by material name, or browse or search properties. Available properties include:

Thermophysical Properties Electrical Properties Mechanical Properties - Modulus Mechanical Properties - Strength Mechanical Properties - Stress Mechanical Properties - Fatigue Mechanical Properties - Creep Mechanical Properties - Others Optical Properties Other Properties

TPMD

Using MPMD, you can browse by material group, search by material name, or browse or search properties. Available properties include:

  • Thermophysical properties:
    • Coeff. of Thermal Linear Expansion
    • Density
    • Glass Transition Temperature
    • Lattice Parameter
    • Moisture Linear Expansion
    • Specific Heat, (At Constant Pressure)
    • Specific Heat Capacity
    • Thermal Conductivity,W cm[-1] K[-1]
    • Thermal Conductivity,W m[-1] K[-1]
    • Thermal Diffusivity,cm[2] s[-1]
    • Thermal Diffusivity,m[2] s[-1]
    • Thermal Linear Expansion
    • Viscosity
  • Thermoradiative properties
  • Optical properties
  • Other properties
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