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From WolfWikis

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• 13:33, 14 November 2008 (hist) (diff) Symmetry of solids/Topic 5‎ (→A simple example, the N=4 case) (top)
• 13:22, 14 November 2008 (hist) (diff) Symmetry of solids/Topic 3‎ (→The complex plane) (top)
• 23:07, 15 August 2008 (hist) (diff) m CH 431/Lecture 1‎ (→Molality) (top)
• 21:15, 15 August 2008 (hist) (diff) m CH 431/Lecture 1‎ (→Some history)
• 14:14, 12 August 2008 (hist) (diff) CH 101/Keys 1‎ (→Exercise 1)
• 14:13, 12 August 2008 (hist) (diff) CH 101/Exercises 1‎ (→Exercises) (top)
• 14:13, 12 August 2008 (hist) (diff) CH 101/Exercises 1‎ (→Exercises)
• 16:01, 6 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists) (top)
• 03:39, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Publications Illustrating Lithography Concepts)
• 03:39, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:39, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:23, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:23, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:20, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Solvent-Assisted Micromolding)
• 03:20, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Solvent-Assisted Micromolding)
• 03:19, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:19, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:18, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:18, 5 May 2008 (hist) (diff) Image:LargerPattern.jpg‎ ((B)SEM images of micrometer-sized structures and 170-nm-wide nanowires formed by etching a 100-nm-thickCusubstrate using a bath containing NBSA and large PEI molecules. The NBSA/P I etch system remains selective even for etching a rough, 2.2-ím-thick, e) (top)
• 03:15, 5 May 2008 (hist) (diff) Image:HealingPattern.jpg‎ ((B) Au printed with a poly(dimethylsiloxane) stamp inked with a 0.02mMsolution ofECTin ethanol etched entirely, except when octanol molecules were present in theCN-/O2 bath (C) and blocked defects in the incomplete, printed SAM. (D) Printing ECT at 0.2 mM) (top)
• 03:14, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:06, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 03:03, 5 May 2008 (hist) (diff) Image:LargerEtchantResist.jpg‎ (An etch system can be made highly selective if at least one of the molecules necessary to etch the substrate cannot penetrate through defects in the monolayer resist. Image from <i>Langmuir</i> <b>2002</b>, <i>18</i>, 2364-2377) (top)
• 03:02, 5 May 2008 (hist) (diff) Image:HealingResist.jpg‎ (Etch selectivity of substrates covered with monolayer resists can improve by the addition of defect-healing molecules to the etch bath. (A) Defect-healing additives, such as octanol, have a high affinity for defects in SAMs but not for the bare substrate.) (top)
• 02:50, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Replica Molding)
• 02:50, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Defect-Tolerant and Directional Wet-Etch Systems for Using Monolayers as Resists)
• 02:50, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Solvent-Assisted Micromolding)
• 02:50, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Solvent-Assisted Micromolding)
• 02:49, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Solvent-Assisted Micromolding)
• 02:49, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Solvent-Assisted Micromolding)
• 02:48, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Solvent-Assisted Micromolding)
• 02:48, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 02:46, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 02:45, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 02:42, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 02:42, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 02:11, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 02:11, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 02:08, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 01:57, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 01:57, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 01:53, 5 May 2008 (hist) (diff) Image:WetEtchSEM.jpg‎ (Left: SEM images of test patterns on layers of silver (A, B, C: 50 nm thick; D: 200 nm thick) that were fabricated by mCP with HDT followed by chemical etching in an aqueous solution of ferricyanide. The patterns in A and B were printed with rolling stamp) (top)
• 01:44, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 01:43, 5 May 2008 (hist) (diff) Image:WetEtchTable.jpg‎ (Selective etchants that have been used with patterned SAMs generated by μCP (all wet etchants were used in aqueous solutions). [a] These SAMs are formed by contact of RSiCl3 or RSi(OCH3)3 with the substrates. Image from <i>Angew. Chem. Int. Ed.</i> <b) (top)
• 01:37, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 01:34, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Wet Etching)
• 01:31, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Microcontact printing)
• 01:30, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Microtransfer Molding)
• 01:29, 5 May 2008 (hist) (diff) Soft Lithography‎
• 01:26, 5 May 2008 (hist) (diff) Soft Lithography‎ (→Publications Illustrating Lithography Concepts)

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